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1

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Evaluation of Materials for Fan-Out Panel Level Packaging (FOPLP) Applications

Sekhar, Vasarla Nagendra, Rao, Vempati Srinivasa, Yamamoto, Kazunori, Fujinaga, Tetsushi, Jono, Koichi, Matsui, Hiroshi, Yoshiteru, Takaya, Yukio, Horiguchi

Year:

2018

Language:

english

File:

PDF, 549 KB

english, 2018

2

Different population histories of the Mundari- and Mon-Khmer-speaking Austro-Asiatic tribes inferred from the mtDNA 9-bp deletion/insertion polymorphism in Indian populations

Kumarasamy Thangaraj, Vempati Sridhar, Toomas Kivisild, Alla G. Reddy, Gyaneshwer Chaubey, Vijay Kumar Singh, Suminder Kaur, Pooja Agarawal, Amit Rai, Jalaj Gupta, Chandana Basu Mallick, Niraj Kumar,

Journal:

Year:

2006

Language:

english

File:

PDF, 120 KB

english, 2006

3

The characteristics, experiences and perceptions of homeopaths in New Zealand: results from a national survey of practitioners

Cottingham, Phillip, Adams, Jon, Vempati, Ram, Dunn, Jill, Sibbritt, David

Journal:

Year:

2017

Language:

english

File:

PDF, 226 KB

english, 2017

4

Effect of inlet swirl on the performance of annular diffusers having the same equivalent cone angle

Singh, S N, Seshadri, V, Saha, K, Vempati, K K, Bharani, S

Journal:

Proceedings of the Institution of Mechanical Engineers Part G Journal of Aerospace Engineering

Year:

2006

Language:

english

File:

PDF, 604 KB

english, 2006

5

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Fine pitch copper wire bonding on 45nm tech Cu/low-k chip with different bond pad metallurgy

Leong Ching Wai,, Jaafar, Norhanani Binte, Chew, Michelle, Sivakumar,, Gunasekaran,, Kanchet,, Witarsa, David, Tan Juan Boon,, Srinivasa, Vempati Rao, Chai, TC, Alastair,, Woo, Jasmine

Year:

2011

Language:

english

File:

PDF, 1.29 MB

english, 2011

6

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications

Rao, Vempati Srinivasa, Chong, Chai Tai, Ho, David, Zhi, Ding Mian, Choong, Chong Ser, PS, Sharon Lim, Ismael, Daniel, Liang, Ye Yong

Year:

2016

Language:

english

File:

PDF, 2.23 MB

english, 2016

7

Generalized state estimation

Alsac, O., Vempati, N., Stott, B., Monticelli, A.

Journal:

IEEE Transactions on Power Systems

Year:

1998

Language:

english

File:

PDF, 818 KB

english, 1998

8

[IEEE 2013 IEEE International Conference on Fuzzy Systems (FUZZ-IEEE) - Hyderabad, India (2013.07.7-2013.07.10)] 2013 IEEE International Conference on Fuzzy Systems (FUZZ-IEEE) - T-S fuzzy model based Maximum Power Point Tracking control of photovoltaic system

Kumar, Avanish, Vempati, Anurag Sai, Behera, Laxmidhar

Year:

2013

Language:

english

File:

PDF, 364 KB

english, 2013

9

Bed of Nails—100-m-Pitch Wafer-Level Interconnections Process

Vempati, S.R., Tay, A.A.O., Kripesh, V., Seung Wook Yoon

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2008

Language:

english

File:

PDF, 2.36 MB

english, 2008

10

A Novel Test Strategy for Fine Pitch Wafer-Level Packaged Devices

Jayabalan, Jayasanker, Rotaru, Mihai Dragos, Rao, Vempati Srinivasa, Kripesh, Vaidyanathan, Iyer, Mahadevan Krishna, Tay, Andrew A. O., Ooi, Ban-Leong, Leong, Mook-Seng

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 2.71 MB

english, 2007

11

[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Process and challenges of ultra-thick spin-on photoresist

Ho, Soon Wee, Sek, Soon Ann, Lau, Boon Long, Rao, Vempati Srinivasa, Chai, Tai Chong

Year:

2015

Language:

english

File:

PDF, 637 KB

english, 2015

12

Simplified Feeder Modeling for Loadflow Calculations

Vempati, N., Shoults, R. R., Chen, M. S., Schwobel, L.

Journal:

IEEE Transactions on Power Systems

Year:

1987

Language:

english

File:

PDF, 774 KB

english, 1987

13

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Evaluation of ultra thick photo resist for high aspect ratio bumping applications

Fernandez, D.M., Rao, Vempati Srinivsa, Soon Wee Ho David,, Wai Hong See Toh Justin,, Li Yan Siow,

Year:

2011

Language:

english

File:

PDF, 2.91 MB

english, 2011

14

The characteristics, experiences and perceptions of naturopathic and herbal medicine practitioners: results from a national survey in New Zealand

Cottingham, Phillip, Adams, Jon, Vempati, Ram, Dunn, Jill, Sibbritt, David

Journal:

BMC Complementary and Alternative Medicine

Year:

2015

Language:

english

File:

PDF, 592 KB

english, 2015

15

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Reliability Results of 0.8 mil Fine Pitch Copper wire bonding on Immersion Gold Plated Pad for Copper Low-k Devices

Wai, Leong Ching, Zhang, Xiaowu, Kripesh, V., Premachandran, C. S., Chong, S.C., Liu, Ying Ying, Madhukumar, J., Srinivas, Vempati Rao, Thaw, PP, Jong, MJ, Lau, John H., Wang, Sandy, Foo, CK, Thew, ML

Year:

2008

Language:

english

File:

PDF, 5.84 MB

english, 2008

16

Panel Warpage of Fan-Out Panel Level Packaging using RDL-First Technology

Che, Fa Xing, Yamamoto, Kazunori, Rao, Vempati Srinivasa, Sekhar, Vasarla Nagendra

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

Language:

english

File:

PDF, 925 KB

english, 2019

17

Orthogonal sparse vector methods

Vempati, N., Slutsker, I.W., Tinney, W.F.

Journal:

IEEE Transactions on Power Systems

Year:

1992

Language:

english

File:

PDF, 723 KB

english, 1992

18

Sensitive Surface States and their Passivation Mechanism in CdS Quantum Dots

Vempati, Sesha, Ertas, Yelda, Uyar, Tamer

Journal:

The Journal of Physical Chemistry C

Year:

2013

Language:

english

File:

PDF, 472 KB

english, 2013

19

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Development of 3D silicon module with TSV for system in packaging

Khan, Navas, Vempati Srinivasa Rao,, Lim, Samule, Ho Soon We,, Lee, Vincent, Zhang Xiao Wu,, Yang Rui,, Liao Ebin,, Ranganathan,, Chai, T.C., Kripesh, V., Lau, John

Year:

2008

Language:

english

File:

PDF, 1.11 MB

english, 2008

20

Fluorescence from graphene oxide and the influence of ionic, π–π interactions and heterointerfaces: electron or energy transfer dynamics

Vempati, Sesha, Uyar, Tamer

Journal:

Physical Chemistry Chemical Physics

Year:

2014

Language:

english

File:

PDF, 4.14 MB

english, 2014

21

False discovery rate based distributed detection in the presence of Byzantines

Vempaty, Aditya, Ray, Priyadip, Varshney, Pramod

Journal:

IEEE Transactions on Aerospace and Electronic Systems

Year:

2014

Language:

english

File:

PDF, 643 KB

english, 2014

22

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Development of negative profile of dry film resist for metal lift off process

Chew, Michelle, Ho, Soon Wee, Su, Nandar, Liao, Ebin, Rao, Vempati Srinivas, Premachandran, C S, Kumar, Rakesh, Damaruganath, Pinjala

Year:

2009

Language:

english

File:

PDF, 401 KB

english, 2009

23

[IEEE 2019 International Conference on Wireless Communications Signal Processing and Networking (WiSPNET) - Chennai, India (2019.3.21-2019.3.23)] 2019 International Conference on Wireless Communications Signal Processing and Networking (WiSPNET) - Hop-Count based Distance Estimation in Wireless Sensor Networks under Byzantine Attacks

Vempaty, Aditya

Year:

2019

File:

PDF, 2.03 MB

2019

24

Solution-based synthesis of cobalt-doped ZnO thin films

Sesha Vempati, Amitha Shetty, P. Dawson, K.K. Nanda, S.B. Krupanidhi

Journal:

Thin Solid Films

Year:

2012

Language:

english

File:

PDF, 1.29 MB

english, 2012

25

Sequential bad data analysis in state estimation using orthogonal transformations

Vempati, N., Shoults, R.R.

Journal:

IEEE Transactions on Power Systems

Year:

1991

Language:

english

File:

PDF, 915 KB

english, 1991

26

[IEEE 2012 International Conference on Emerging Trends in Electrical Engineering and Energy Management (ICETEEEM) - Chennai, Tamil Nadu, India (2012.12.13-2012.12.15)] 2012 International Conference on Emerging Trends in Electrical Engineering and Energy Management (ICETEEEM) - Design and Simulation of single-stage single-switch electronic ballast with SEPIC topology for fluorescent lamps

Reddy, Vempati Venkateaswar, Paleti, Srikanth

Year:

2012

Language:

english

File:

PDF, 2.16 MB

english, 2012

27

Solutions Strategies for Die Shift Problem in Wafer Level Compression Molding

Sharma, Gaurav, Kumar, Aditya, Rao, Vempati Srinivas, Ho, Soon Wee, Kripesh, Vaidyanathan

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 1.82 MB

english, 2011

28

Associative behaviour and role of functional groups on the fluorescence of graphene oxide

Ozcan, Sefika, Vempati, Sesha, Cirpan, Ali, Uyar, Tamer

Journal:

Physical Chemistry Chemical Physics

Year:

2018

Language:

english

File:

PDF, 2.65 MB

english, 2018

29

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package

Rao, Vempati Srinivasa, Chong, Chai Tai, Ho, David, Zhi, Ding Mian, Choong, Chong Ser, PS, Sharon Lim, Ismael, Daniel, Liang, Ye Yong

Year:

2017

Language:

english

File:

PDF, 2.40 MB

english, 2017

30

High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP)

Ying Ying Lim, Xianghua Xiao, Vempati, S.R., Su, N., Kumar, A., Sharma, G., Teck Guan Lim, Vaidyanathan, K., Jinglin Shi, Lau, J.H., Shiguo Liu

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 1.91 MB

english, 2010

31

Development of Package-on-Package Using Embedded Wafer-Level Package Approach

Chong, Ser Choong, Wee, David Ho Soon, Rao, Vempati Srinivasa, Vasarla, Nagendra Sekhar

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 1.97 MB

english, 2013

32

Sneutrino vacuum expectation values and neutrino anomalies through trilinear R -parity violation

Joshipura, Anjan S., Vempati, Sudhir K.

Journal:

Physical Review D

Year:

1999

Language:

english

File:

PDF, 65 KB

english, 1999

33

Chemical and physical effects of sodium lignosulfonate superplasticizer on the hydration of portland cement and solidification/stabilization consequences

M. Yousuf, A. Mollah, Padmavathy Palta, Thomas R. Hess, Rajan K. Vempati, David L. Cocke

Journal:

Cement and Concrete Research

Year:

1995

Language:

english

File:

PDF, 889 KB

english, 1995

34

Systemic review on drug related hospital admissions – A pubmed based search

Nivya, Kolli, Sri Sai Kiran, Vempati, Ragoo, Nandita, Jayaprakash, B., Sonal Sekhar, M.

Journal:

Saudi Pharmaceutical Journal

Year:

2015

Language:

english

File:

PDF, 474 KB

english, 2015

35

[IEEE 2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) - Chicago, IL (2014.8.26-2014.8.30)] 2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society - Non-invasive blood glucose monitor based on spectroscopy using a smartphone

Dantu, Vishnu, Vempati, Jagannadh, Srivilliputhur, Srinivasan

Year:

2014

Language:

english

File:

PDF, 829 KB

english, 2014

36

An application of genetic algorithms for flow shop problems

Chuen-Lung Chen, Venkateswara S. Vempati, Nasser Aljaber

Journal:

European Journal of Operational Research

Year:

1995

Language:

english

File:

PDF, 555 KB

english, 1995

37

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

Zhang, Xiaowu, Chai, T.C., Lau, John H., Selvanayagam, C. S., Biswas, Kalyan, Shiguo Liu,, Pinjala, D., Tang, G.Y., Ong, Y.Y., Vempati, S.R., Wai, Eva, Li, H.Y., Liao, E.B., Ranganathan, N., Kripesh,

Year:

2009

Language:

english

File:

PDF, 2.15 MB

english, 2009

38

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Low temperature bonding studies of Au-studs and AuSn-solder bumps on Au-surface using ultrasonic energy

Aw, Jie Li, Lee, Jong Bum, Jaafar, Norhanani, Ding, Mian Zhi, Lim, Li-Shiah, Choong, Chong Ser, Rao, Vempati Srinivasa

Year:

2013

Language:

english

File:

PDF, 1.11 MB

english, 2013

39

[IEEE 2015 IEEE Information Theory Workshop (ITW) - Jerusalem, Israel (2015.4.26-2015.5.1)] 2015 IEEE Information Theory Workshop (ITW) - CEO problem for belief sharing

Vempaty, Aditya, Varshney, Lav R.

Year:

2015

Language:

english

File:

PDF, 273 KB

english, 2015

40

[Society of Petroleum Engineers Middle East Drilling Technology Conference & Exhibition - Manama, Bahrain (2009-10-26)] Middle East Drilling Technology Conference & Exhibition - New Generation PDC Bits Successfully Replace Impregnated Bits Resulting in Significant Performance Improvements and Savings for the Operator

AL Nabhani, Yaqdhan Nasser, Obame-Ondo, Henri, Al-Kindi, Mahmoud Ahmed, Saidi, Ahmed, Al-Sheriyani, Moosa Bader, Reek, Edwin, Vempati, Chaitanya, Cruz, Marco

Language:

english

File:

PDF, 584 KB

english

41

Combined buoyancy and viscous effects in liquid–liquid flows in a vertical pipe

Bhadraiah Vempati, Mahesh V. Panchagnula, Alparslan Öztekin, Sudhakar Neti

Journal:

Year:

2010

Language:

english

File:

PDF, 505 KB

english, 2010

42

A TRA Bridge Technique for In-Circuit Impedance Measurement

Rahman, Mahfoozur, Ahmed, Muslim T., Murti, Vempati G. K.

Journal:

IEEE Transactions on Instrumentation and Measurement

Year:

1984

Language:

english

File:

PDF, 1.03 MB

english, 1984

43

Enhancement to Givens rotations for power system state estimation

Vempati, N., Slutsker, I.W., Tinney, W.F.

Journal:

IEEE Transactions on Power Systems

Year:

1991

Language:

english

File:

PDF, 882 KB

english, 1991

44

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - A novel method to predict die shift during compression molding in embedded wafer level package

Chee Houe Khong,, Kumar, Aditya, Xiaowu Zhang,, Sharma, Gaurav, Vempati, Srinivasa Rao, Vaidyanathan, Kripesh, Lau, John Hon-Shing, Dim-Lee Kwong,

Year:

2009

Language:

english

File:

PDF, 2.55 MB

english, 2009

45

Assessment of possibility of saltwater intrusion in the central Godavari delta region, Southern India

Surinaidu, Lagudu, Gurunadha Rao, Velidi V. S., Mahesh, Jampani, Prasad, Patury Rajendra, Tamma Rao, Gopu, Sarma, Vempati Subramanya

Journal:

Regional Environmental Change

Year:

2015

Language:

english

File:

PDF, 4.18 MB

english, 2015

46

YOGA-BASED GUIDED RELAXATION REDUCES SYMPATHETIC ACTIVITY JUDGED FROM BASELINE LEVELS

VEMPATI, R. P., TELLES, SHIRLEY

Journal:

Psychological Reports

Year:

2002

Language:

english

File:

PDF, 299 KB

english, 2002

47

Is lignocaine with out adrenaline a better choice for lip wounds crossing vermillion border?

Vempaty, S., Madattigowda, R., Sheikh, O., Shorafa, M.

Journal:

International Journal of Oral & Maxillofacial Surgery

Year:

2017

Language:

english

File:

PDF, 40 KB

english, 2017

48

Patient's perception of lingual and inferior dental nerve paraesthesia following mandibular third molar extraction–a telephonic survey

Madattigowda, R., Vempaty, S.

Journal:

International Journal of Oral & Maxillofacial Surgery

Year:

2017

Language:

english

File:

PDF, 50 KB

english, 2017

49

Neutrino mass constraints on R violation and HERA anomaly

Anjan S Joshipura, V Ravindran, Sudhir K Vempati

Journal:

Physics Letters B

Year:

1999

Language:

english

File:

PDF, 135 KB

english, 1999

50

Gauge mediated supersymmetry breaking and neutrino anomalies

Joshipura, Anjan S., Vempati, Sudhir K.

Journal:

Physical Review D

Year:

1999

Language:

english

File:

PDF, 112 KB

english, 1999

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